| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| FE1.1S-BQFN24B |
|
逻辑IC |
TERMINUS/汤铭 |
QFN24 |
20+ |
6985 |
||
| CAT5171TBI-50GT3 |
|
模拟IC |
ONSEMI/安森美 |
SOT-23 |
24+ |
60000 |
||
| PCAL6416AHF |
|
存储IC |
NXP/源装 |
QFN-24 |
2124+ |
6000 |
||
| USB3320C-EZK-TR |
|
接口IC |
MICROCHIP/微芯 |
QFN32 |
21+ |
15000 |
||
| AD5175BRMZ-10 |
|
逻辑IC |
ADI/亚德诺 |
MSOP10 |
19+ |
5000 |
||
| FE1.1S-BQFN24B |
|
自动化器件 |
TERMIMU |
QFN24 |
20+ |
8642 |
||
| ADG709BRUZ |
|
逻辑IC |
ADI/亚德诺 |
TSSOP16 |
1940+ |
1000 |
||
| DRV8818PWPR |
|
存储IC |
TI/德州仪器 |
HTSSOP28 |
2140 |
20000 |
||
| MC20901 |
|
模拟器件 |
METICOM |
TQLMP-4 |
1909+ |
2685 |
||
| MC20902 |
|
逻辑IC |
METICOM |
TQLMP-48 |
1845+ |
560 |
||
| ERM5-075-02.0-L-DV-TR | SAMTEC/申泰 |
SMD |
24+ |
375 |
||||
| SP3222EEA | SOURCE PHOTONICS |
SSOP |
1319 |
35 |
||||
| SN74LVC2G74DCTR | 逻辑IC |
TI/德州仪器 |
SM8 |
2205 |
13350 |
|||
| PCAL6416AHF | 其他被动元件 |
NXP/恩智浦 |
QFN24 |
21+ |
24500 |
|||
| GRM188R60J475KE19D | MURATA/村田 |
603 |
21+ |
3520 |
||||
| 665308124022 | 贴片电容 |
WURTH/伍尔特 |
Reel |
22+ |
1000 |
|||
| THS4031CDGNR | 音频IC |
TI/德州仪器 |
MSOP8 |
1819 |
15 |
|||
| SYT01A03DXC | 电源IC |
SILERGY/矽力杰 |
DFN0.6X0.3-2L |
1942 |
40000 |
|||
| MMSZ4701T1G | 稳压(齐纳)二极管 |
ONSEMI/安森美 |
SOD-123W |
1844 |
12000 |
|||
| TUSB564IRNQ | TI/德州仪器 |
WQFN |
20+ |
240 |
||||
| ADP1714AUJZ-3.3 | ADI/亚德诺 |
SOT23 |
1619+ |
6000 |
||||
| ISL68300IRAZ-TK | 电源IC |
INTERSIL |
QFN-24 |
1817+ |
540 |
|||
| INA226AIDGSR | 模拟IC |
TI/德州仪器 |
MSOP10 |
2128 |
54 |
|||
| 74LVC2G74DP | NXP支持实单 |
SM8 |
22+ |
6350 |
||||
| OPA277UA | 运放IC |
BURR-BROWN |
SOP |
50 |
||||
| TPS54327DDAR | 电源IC |
TI/德州仪器 |
SOP8 |
2123+ |
2422 |
|||
| CYBLE-212019-00 | 贴片电容 |
CYPRESS/赛普拉斯 |
SMD |
21+ |
1154 |
|||
| SST39SF040-55-4C-NHE |
|
其他被动元件 |
MICROCHIP/微芯 |
PLC-32 |
21+ |
2300 |
||
| THS3121CDR |
|
模块 |
TI/德州仪器 |
SOP-8 |
2018+ |
325 |
||
| OPA2277PA | 运放IC |
TI/德州仪器 |
DIP8 |
2027 |
50 |